Preliminary
iEP-9040VE Compact Edge AIoT Platform
- Intel® Core™ Processors (Series 2) with R680E Chipset
- 2 x 262-pin DDR5 SO-DIMM up to 96GB (48GB per DIMM)
- 1 x M.2 Key M
- 4 x USB 3.2 Gen2x1, 2 x Internal USB 3.2 Gen2x1 (Optional)
- 2 x Intel 1G LAN (LAN1 supports vPro)
- 2 x COM, 2 x SATA3, 4 x DI, 4 x DO
- 1 x Displayport, 2 x HDMI 2.0b
- Optional Kit: PoE function card, 10BASE-T1S function card, OOB function card
Specification
Processor System
| CPU | Intel® Core™ Processors (Series 2) |
|---|---|
| Chipset | Intel® R680E |
| Socket | LGA 1700 |
Memory
| Technology | Dual Channel DDR5 5600MHz (ECC memory supported by R680E + Selected CPU) |
|---|---|
| Capacity | 96 GB (48 GB per DIMM) |
| Socket | 2 x 262-pin SO-DIMM |
Graphics
| Controller | Intel® UHD Graphics |
|---|---|
| DisplayPort | DisplayPort 1.4a , DP++ Max resolution up to 4096x2160@60Hz |
| HDMI | HDMI 2.0b Max resolution up to 4096x2160@60Hz |
Audio
| Interface | Realtek ALC897, High Definition Audio. |
|---|
Ethernet
| Controller/ Speed | 1 x Intel® i219LM (vPro Support) 1 x Intel® i210IT |
|---|---|
| Connector | 2 x RJ45 |
Front I/O
| DisplayPort | 1 |
|---|---|
| HDMI | 2 |
| Ethernet | 2 x Intel 1G LAN |
| USB | 4 x USB 3.2 Gen2x1, 2 x Internal USB 3.2 Gen2x1 (Optional) |
| Audio | 1 x Line-in, 1 x Line-out |
| COM | 2 x RS232/422/485 |
| DIO | 4DIs/4DOs |
Storage
| M.2 | 1 x M.2 (Key M, 2242/2260/2280/22110/25110) with Gen4 x4 for NVMe SSD |
|---|---|
| SATA | 2 x SATA3 (6Gb/s), R680E: support RAID 0/1 |
| CFast | 1 x Type II socket (Shared with SATA3) |
Watchdog Timer
| Output | From Super I/O to drag RESETCON# |
|---|---|
| Interval | 256 Segments, 0, 1, 2, ...255sec |
Power Requirements
| Input PWR | 9V~36V DC OVP, UVP, OCP and reverse protection for MB Power Input. Ignition Power Input w/ 13-mode condition. |
|---|
Environment
| Operating Temp | 45W CPU: - 40°C ~ 55°C (-40°F ~ 131°F) 65W CPU: - 40°C ~ 50°C (-40°F ~ 122°F) (w/ air flow 0.5~0.8 m/s) |
|---|---|
| Storage Temp | -40°C~85°C ( -40°F~185°F) |
| Humidity | ~95% @ 40°C (non-condensing) |
| Shock | MIL-STD-810H, Method 516.8, Procedure I |
| Vibration | MIL-STD-810H, Method 514.8 |
| ESD | Contact +/-4kV, Air +/-8kV |
| EMC | EN61000-6-4/-2, CE & FCC Class A |
| Safety | LVD |
Mechanical
| Construction | Aluminum heatsink + Metal chassis |
|---|---|
| Mounting | Desk Mount |
| Dimensions | 200mm (W) x 230mm (D) x 93mm (H) (7.87" x 9.06" x 3.66") |
| Net Weight | 6kg |
Others
| OS Support | Windows 11 & Windows 10 & Linux |
|---|---|
| TPM | TPM 2.0 |
| Real-Time Enablement | TSN, TCC support under YOCTO |
The specification is subject to change without notice in advance. The brand and product names are trademarks of their respective companies. Any configuration other than original product specification is not guaranteed.