A Race Towards Autonomous Mobility: ASRock Industrial Empowers Dynamis PRC's Driverless Car for Formula Student

In a race towards victory, ASRock Industrial partners with Dynamis PRC to power up its race car's autonomous driving system for the Formula Student competition, speeding up development time while boosting performance for its ambitious targets in the race.

挑战

Formula Student is one of the world's most competitive international automobile design competitions for university student teams. Each team designs and builds a formula-style competition vehicle to enter the race. After years of competition and practice, an Italian team Dynamis PRC achieved 4th place globally in 2019 in the combustion category and ranked 1st nationally in 2021. With the rising trend of autonomous car, they are racing to transform to a driverless prototype for the 2022 seasons and beyond. To finish the Formula Student race every year is a challenging project for the student teams, especially when designing a self-driving car that exhibits high performances and meets safety standards. The team not only needs to invest heavily in the R&D, manufacturing workforce and acquiring funds, they also need to complete the prototype design in nine months and pass the string tests to ensure that the vehicle can achieve optimal speed under safe conditions.

解决方案

ASRock Industrial collaborates with Dynamis PRC, providing its latest Intel® 10th Gen. CPU motherboard IMB-1222 to power up the prototype's electric system conversion into the driverless car. In the driverless system, there are cameras and lidar connected to the motherboard, forming sensory data through perception, mapping, localization, and control algorithms. Moreover, the Inertial Navigation System unit is used to obtain measurements on speed, acceleration, and other critical areas for precise calculations that ensure reliable information is added to input commands for the vehicle.

The IMB-1222 with the latest Intel® 10th Gen. Core™ i9 Processor and a GPU card run Robot Operating System (ROS) on Ubuntu, Linux, and all other driverless algorithms, powering the neural network of the driverless system for real-time computing and AI inference. Through utilizing deep learning, the system can precisely determine the position of all items within the vehicle’s proximity and calculate the optimal trajectory for effective and optimal movements.

On top of autonomous system management, the IMB-1222 also facilitates powering of critical safety indicators such as steering system, electronic brake system, and other safety measures while navigating the car. A self-developed PCB- the Autonomous System Unit, manages the physical steering actuator control and connects with the rest of the car via CAN Bus while communicating with the computer via RS232, utilizing the benefit of IMB-1222 serial ports. In addition, Dynamis PRC also developed a battery pack to power the IMB-1222 and GPU package. The battery permits vehicle testing for approximately one hour at the maximum performance level.

IMB-1222 powers up the prototype's autonomous driving system

引进效益

Speed Up Development Time:

adopt ASRock Industrial's IMB-1222 to speed up development time of the autonomous racing car to the duration of nine months.

Boost Performance in Formula Student:

ASRock Industrial's Intel® 10th Gen motherboard powers up the race car's autonomous driving system, boosting its performance during its participation in the competition.

The 1st Autonomous Race Car:

the partnership provides the collaborative work of Dynamis PRC's first autonomous race car that is high-performing and safe for the race.

相关产品

IMB-1222

  • Intel® 10th Gen (Comet lake-S) Core™ Processors with Q470E chipset
  • 2 x 260-pin SO-DIMM Support Dual Channel DDR4 2933 (i9 / i7 CPU) / 2666 (i5 / i3 CPU) / 2400 (Pentium / Celeron CPU), up to 64GB
  • 1 x PCIe x16 Gen3, 6 x USB 3.2 Gen1, 4 x USB 2.0, 1 x M.2 Key E, 1 x M.2 Key M, 1 x M.2 Key B, 4 x COM, 2 x SATA3
  • 1 x Intel 2.5 Gigabit LAN, 1 x Intel 1 Gigabit LAN
  • Support Triple display, 2 x DP 1.2, 1 x LVDS or eDP, 1 x HDMI 2.0a
  • TPM 2.0 onboard
  • Special Feature: Supports Intel® vPro, AMT, RAID 0/1/5/10
  • DC-in 12V
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IMB-X1222-WV

  • Intel® Xeon & 10th Gen (Comet lake-S) Core™ Processors with W480E chipset
  • 2 x 260-pin SO-DIMM Support Dual Channel SO DIMM DDR4 2933 (i9 / i7 CPU) / 2666 (i5 / i3 CPU) / 2400 (Pentium / Celeron CPU), up to 64GB
  • Support ECC SO DIMM memory modules
  • 1 x PCIe x16 Gen3, 6 x USB 3.2 Gen1, 4 x USB 2.0
  • 1 x M.2 Key E, 1 x M.2 Key M, 1 x M.2 Key B, 4 x COM, 2 x SATA3
  • 1 x Intel 2.5 Gigabit LAN, 1 x Intel 1 Gigabit LAN
  • Support Triple display, 2 x DP 1.2, 1 x LVDS or eDP, 1 x HDMI 2.0a
  • TPM 2.0 onboard
  • Special Feature: Supports Intel® vPro, AMT, RAID 0/1/5/10
  • 12V~28V DC-in
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IMB-1222-WV

  • Intel® 10th Gen (Comet lake-S) Core™ Processors with Q470E chipset
  • 2 x 260-pin SO-DIMM Support Dual Channel DDR4 2933 (i9 / i7 CPU) / 2666 (i5 / i3 CPU) / 2400 (Pentium / Celeron CPU), up to 64GB
  • 1 x PCIe x16 Gen3, 6 x USB 3.2 Gen1, 4 x USB 2.0, 1 x M.2 Key E, 1 x M.2 Key M, 1 x M.2 Key B, 4 x COM, 2 x SATA3
  • 1 x Intel 2.5 Gigabit LAN, 1 x Intel 1 Gigabit LAN
  • Support Triple display, 2 x DP 1.2, 1 x LVDS or eDP, 1 x HDMI 2.0a
  • TPM 2.0 onboard
  • Special Feature: Supports Intel® vPro, AMT, RAID 0/1/5/10
  • 12V~28V DC-in
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iEPF-9000S-EX4

  • Intel® 10th Gen Xeon® W or Core™ Processors with W480E Chipset
  • 4 x 260-pin DDR4 SO-DIMM up to 128GB (32GB per DIMM)
  • 1 x PCIe x16 (PCIe Gen3) or 2 x PCIe x8 (PCIe Gen3), 2 x PCIe x4 (PCIe Gen3)
  • 1 x M.2 Key M, 1 x M.2 Key B, 1 x M.2 Key E, 2 x Mini PCIe
  • 4 x USB 3.2 Gen2x1, 2 x USB 2.0, 6 x COM, 4 x SATA3, 8 x DI, 8 x DO
  • 5 x Intel Gigabit LAN (2 support PoE)
  • Supports Triple Display, 2 x Displayport, 1 x VGA
  • Powerful Edge AI acceleration enabled by the most flexible mechanical, thermal, and power design, with support for 275mm x 121mm x 42mm (L x Hx D) max. and up to 255W graphic card
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iEP-9000E

  • Intel® 10th Gen Xeon® W or Core™ Processors with W480E Chipset
  • 4 x 260-pin DDR4 SO-DIMM up to 128GB (32GB per DIMM)
  • 1 x M.2 Key M, 1 x M.2 Key B, 1 x M.2 Key E, 2 x Mini PCIe
  • 4 x USB 3.2 Gen2x1, 2 x USB 2.0, 6 x COM, 4 x SATA3, 8 x DI, 8 x DO
  • 5 x Intel Gigabit LAN (2 support PoE)
  • Supports Triple Display, 2 x Displayport, 1 x VGA
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